Decades of technical strength combine with the cutting-edge technology in the industry.
HSG Laser has launched a new HSGX8500 high-power professional plate cutting system to bring users a simple, flexible and efficient high-power thick plate cutting experience.
Rich auxiliary functions, challenging the stability of higher power performance, abandoning all kinds of complex operations, and creating an exquisite upgraded experience
——This is HSGX8500.7 Core Technologies To Unlock The Wisdom Of Cutting Experience
After perforation, the cutting head adjusts to the proper height, avoiding slag, preventing from shaking, and achieving smoothly cutting of thick plates.
Smooth & Flawless Cutting
Special process optimization, to achieve the end position of the closed figure is smooth and flawless.
According to the depth of the perforation, the appropriate laser process can be automatically adjusted to achieve the rapid and stable penetration of the thick plate without slag.
You can choose any graphics to start the cutting, and there is no need to worry about processing accidents. Each part is a finished product with only One-click repeated processing.
Remaining Materials Cutting Presenting
No graphics are needed, simply presenting different positions, you can cut according to the path, no restrictions on the graphics, saving materials and costs.
Innovative integration, compatible with international brand processing codes
Compatible with TRUMPF, Bystronic and other brand processing codes, with good versatility, flexibility and convenience.
The brand new HSG-X8500 high power sheet cutting system presents an intelligent experience for thick sheet cutting.